Samtec Intel HSMC

ASP-122952-01 Male Intel® HSMC Specified Q Strip® Connector (A0078)

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  • Three bank 0.5mm pitch Q Strip® male connector
  • Optimization for high speed protocols such as PCI Express®, Gigabit Ethernet, and AMC
  • HSMC interconnect provides JTAG, high speed serial I/O, as well as SE and DP signal mapping
  • Programmable I/O and flexible layout options
  • Three-bank connector design allowing for SE and DP signals
Part No. Stock Qty Price Breaks Qty
ASP-122952-01  3D CAD
Three Bank Male
Standard delivery
3 - 5 working days *
1+: £9.7710+: £9.5025+: £9.00 View all prices
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  • Technical Specification
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Ground Plane and Terminal Plating:

Contact Area: .000003 MIN GOLD Over .000050~.000100 NICKEL

Remainder: .000150~.000250 TIN OVER .000050~.000100 NICKEL

Intel® HSMC – Q Strip® (QSH/QTH)

The HSMC connectors defined by the specification are based on the 0.50 mm pitch Q Strip® QSH/QTH Products high-speed board-to-board connectors from Samtec. These connectors are partitioned into three “banks.” Bank 1 in each respective connector has every third signal pin removed to allow for multi-gigahertz differential signalling. Bank 2 and Bank 3 in each respective connector have the entire rows of signal pins filled for various single-ended interface signals.

Intel® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.