| Part No. | Stock Qty | Price Breaks | Qty | ||||
|---|---|---|---|---|---|---|---|
|
ASP-122952-01
3D CAD
Three Bank Male |
Standard delivery 3 - 5 working days * |
1+: £9.77 | 10+: £9.50 | 25+: £9.00 | View all prices | ||
* Delivery times are from point of order and subject to material availability.
* When ordering more than in stock, please contact us to confirm delivery time
* Need help or more stock/delivery information or volume pricing - Please contact us
DIMENSIONS IN INCHES
Ground Plane and Terminal Plating:
Contact Area: .000003 MIN GOLD Over .000050~.000100 NICKEL
Remainder: .000150~.000250 TIN OVER .000050~.000100 NICKEL
Intel® HSMC – Q Strip® (QSH/QTH)
The HSMC connectors defined by the specification are based on the 0.50 mm pitch Q Strip® QSH/QTH Products high-speed board-to-board connectors from Samtec. These connectors are partitioned into three “banks.” Bank 1 in each respective connector has every third signal pin removed to allow for multi-gigahertz differential signalling. Bank 2 and Bank 3 in each respective connector have the entire rows of signal pins filled for various single-ended interface signals.
Intel® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
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