Samtec Intel HSMC

ASP-122953-01 Female Intel® HSMC Specified Connectors (Q Strip®) (A0077)

From: £5.082
Copied to clipboard
  • Three bank 0.5mm pitch Q Strip® female connector
  • Optimization for high speed protocols such as PCI Express®, Gigabit Ethernet, and AMC
  • HSMC interconnect provides JTAG, high speed serial I/O, as well as SE and DP signal mapping
  • Programmable I/O and flexible layout options
  • Three-bank connector design allowing for SE and DP signals
Part No. Stock Qty Price Breaks Qty
ASP-122953-01   3D CAD
Three Bank Female
Standard delivery
3 - 5 working days *
1+: £9.5810+: £9.3125+: £8.82 View all prices
When ordering more than in stock, please contact us to confirm delivery time.
There was a problem adding this item to the cart. Please contact us on the above number to order.

* Delivery times are from point of order and subject to material availability.

* When ordering more than in stock, please contact us to confirm delivery time

* Need help or more stock/delivery information or volume pricing - Please contact us

  • Technical Specification
  • Video
  • More Info


Ground Plane and Terminal Plating:

Contact Area: .000003 MIN GOLD Over .000050~.000100 NICKEL

Intel® HSMC – Q Strip® (QSH/QTH)

The HSMC connectors defined by the specification are based on the 0.50 mm pitch Q Strip® QSH/QTH Products high-speed board-to-board connectors from Samtec. These connectors are partitioned into three “banks.” Bank 1 in each respective connector has every third signal pin removed to allow for multi-gigahertz differential signalling. Bank 2 and Bank 3 in each respective connector have the entire rows of signal pins filled for various single-ended interface signals.

Intel® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.