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Insulating body: thermoplastic GF, V-0 according to UL94
Contact spring: Cu alloy, pre-nickel and gold-plated, tin-plated in solder area
Housing: Cu alloy, nickel-plated
Insertion force: ≤ 34,3 N
Withdrawal force: ≥ 9,8 N
Electrical data (at Tamb 20 °C)
Contact resistance: ≤ 30 mΩ
Rated current: 1 A
Rated voltage: 30 V AC
Rated impulse voltage: 500 V AC/60 s
Temperature range: -45 °C/+85 °C
Lumberg Conn USB Type A SKT 8 POS 2mm/2.5mm Solder RA Thru-Hole 8 Terminal 2 Port.
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