Insulator: Black LCP
Contact: Copper Alloy
Weld Tab: Phospher Bronze
Plating: Sn or Au over 50µ" Ni
Operating Temp: -55°C to +105°C Tin / -55°C to +125°C Gold
RoHS Compliant and Lead Free Solderable
Current Rating Per Contact UMPT/UMPS mated
1 Pin = 18.3A / 2 Pins = 14.5A / 3 Pins = 14.2A / 4 Pins = 12.9A / 5 Pins 12.9A
Samtec Micro Rugged Board-to-Board
Micro 2mm pitch power blade interconnects designed for staging a combination power and signal/ground solution. With a variety of mated heights available, design engineers can create unique power/signal combinations to suit their application choosing from a variety of Samtec series.
mPOWER™ can be used as a standalone high-power solution, or alongside one of Samtec’s high-speed connector systems for a unique two-piece power and signal/ground solution. Compatible Samtec high-speed systems include: AcceleRate® HD, Edge Rate®, SEARAY™, SEARAY™ 0.80 mm, LP Array™, Q Strip®, Q2™, Tiger Eye™ and more.
See the data sheet for more on the possible stack height combinations available.