Samtec

HPF - Samtec 5.08mm Power Socket (HPF)

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  • 5.08mm pitch PCB footprint
  • Designed for high-power board-to-board applications
  • Vertical mount socket for through-hole or surface mount
  • Reliable mating with Samtec HPM power headers
  • Supports current ratings up to 16.1 Amps
  • Available from 2 to 20 positions
Part No. Stock Qty Price Breaks Qty
HPF-04-02-T-S  3D CAD
Standard delivery
7 - 9 working days *
1+: £1.9550+: £1.90100+: £1.80 View all prices
When ordering more than in stock, please contact us to confirm delivery time.
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* Delivery times are from point of order and subject to material availability.

* When ordering more than in stock, please contact us to confirm delivery time

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  • Technical Specification
  • More Info

Insulator Material: Black LCP

Contact Material: BeCu

Terminal Material: Copper Alloy

Plating: Sn over 50 μ” (1.27 μm) Ni

Operating Temp Range: -55 °C to +105 °C

Voltage Rating: HPF = 850 VAC / 1202 VDC

Insertion Depth (HPF): 3.68 mm (.145”) to 8.26 mm (.325” - .368”)

(9.35 mm board thickness min. for bottom entry)

Wiping Distance (HPF): 0.38 mm (.015”)

FAQs

Q: What current can Samtec HPF power sockets handle?
A: HPF sockets can support up to 16.1 Amps per contact when mated with a compatible header such as the Samtec HPM series.

Q: Is this socket suitable for through-hole or surface mount?
A: The HPF series is available in both through-hole (-01) and surface mount (-02) lead styles for flexible board design integration.

Q: What is the mating connector for the HPF socket?
A: The HPF power socket mates directly with Samtec's HPM 5.08mm power headers.

Q: How many positions are available in the HPF series?
A: You can configure from 2 to 20 positions depending on your current and layout requirements.

Applications

Ideal for high-current power distribution in industrial systems, motor drives, power supply interfaces, and rugged board-to-board configurations. The HPF socket ensures robust connection integrity and meets the demands of thermal and mechanical performance across various harsh environments.