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SEAF8-40-1-S-10-2-RA-GP 3D CAD
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Standard delivery 8 - 10 working days * |
1+: £39.98 | 10+: £38.87 | 25+: £36.82 | View all prices |
When ordering more than in stock, please contact us to confirm delivery time.
There was a problem adding this item to the cart. Please contact us on the above number to order.
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| Qty. | Unit Price | Ext. Price |
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* Delivery times are from point of order and subject to material availability.
* When ordering more than in stock, please contact us to confirm delivery time.
* Need help or more stock/delivery information or volume pricing - Please contact us
* Delivery times are from point of order and subject to material availability.
* When ordering more than in stock, please contact us to confirm delivery time
* Need help or more stock/delivery information or volume pricing - Please contact us
Insulator Material: Black LCP
Contact Material: Copper Alloy
Plating: Au or Sn over 50 µ" (1.27µm) Ni
Operating Temp Range: -55°C to +125°C
Current Rating: 1.4 A per pin (6 adjacent pins powered)
Working Voltage: 220 VAC
RoHS Compliant
Lead-Free Solderable
SEARAY™ High Density Arrays from Samtec on Vimeo.
These ultra high density, high speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050" pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 10 rows and 50 contacts per row, choice of 7 mm or 10 mm stack height, and high speed 28+ Gbps performance.
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F: +44 (0)1295 271744
E: sales@toby.co.uk
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