FIK - Samtec FireFly™ Test Kit (FIK)

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  • Active optical and copper cable assemblies sold separately
  • Real-time evaluation of optical or copper FireFly™ system
  • Rated up to 25 Gbps
  • Bulls Eye® system allows connection to test equipment
  • Bulls Eye® cable assembly
  • USB to I2C adapter included
  • See print for total list of kit contents
Part No. Stock Qty Price Breaks Qty
Standard delivery
11 - 13 working days *
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When ordering more than in stock, please contact us to confirm delivery time.

* Delivery times are from point of order and subject to material availability.

* When ordering more than in stock, please contact us to confirm delivery time.

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  • Technical Specification
  • More Info

Kit includes:

Firefly sub-assembly


Thermal Material

Heat Sink ASM

Heat Sink Adapter

Rated up to 28 Gbps, this kit allows the designer real-time evaluation of an actively running copper or optical FireFly™ system in their lab, with their inputs.

The evaluation board connects the FireFly™ connector system (UEC5 / UCC8) to a 24-position Bulls Eye® system and brings the low-speed signals and power rails to various standard connectors. The Bulls Eye® system allows for connecting all 12 FireFly™ channels to various laboratory test equipment. A second Bulls Eye® connector landing pad enables the de-embedding of the Bulls Eye® interconnect and PCB effects on the high-speed signals.

Samtec’s future-proof system with interchangeability of FireFly™ copper and optical using the same micro connector system for up to 28 Gbps per lane in x4 and x12 configurations. FireFly™ Micro Flyover System™ is the first interconnect system that gives a designer the flexibility of using micro footprint high-performance optical and low-cost copper interconnects interchangeably with the same connector system. Samtec FireFly™ copper and optical cable systems provide the flexibility to achieve higher data rates to 28 Gbps and/or greater distances, simplifying board design and enhancing performance. The system’s miniature footprint allows for greater density and closer proximity to the IC, enabling chip-to-chip, board-to-board, on-board and system-to-system connectivity.