3823

3823 - Lumberg Wire-to-Board 2.5mm Minimodul™ SIL Crimp Housing (3823)

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  • 2.5mm pitch Minimodul™ connector
  • Single-in-line Crimp Housings
Part No. Stock Qty 2000+ Qty
3823-04-30-02
250pcs Pack
Standard delivery
80 - 82 working days *
£0.15
When ordering more than in stock, please contact us to confirm pricing and delivery time.
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* Delivery times are from point of order and subject to material availability.

* When ordering more than in stock, please contact us to confirm pricing and delivery time

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  • Technical Specification

Environmental conditions

Temperature range -40 °C/+120 °C 1 1 upper limit temperature (insulating body) RTI (electrical) of the UL Yellow Card

Materials

Insulating body:  PA GF, V-0 according to UL94 – 3823 ... 30 1


1 component glow wire resistant (GWT 750 °C), testing acc. to IEC 60695-2-11, assessment acc. To IEC 60335-1 (flame < 2 s)

Electrical data (at Tamb 20 °C)

Rated current:  5,0 A (TU 30 °C), 2,5 A (TU 70 °C)
Rated voltage:  200 V AC (every chamber equipped), 325 V AC (every other chamber equipped)
Material group:  IIIa (CTI ≥ 250) 1Creepage distance:  2,15 mm
Clearance:  1,90 mm
Insulation resistance:  > 1 GΩ
Further data:  See suitable crimp contact