ZA1 - Samtec 1mm Ultra Low Profile Micro Array (ZA1)

From: £3.74
  • Samtec 28+ Gbps Solution
  • Low profile - 1 mm standard height
  • Up to 400 I/Os at 1mm (.0394") pitch
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
Part No. Stock Qty 1+ 100+ 250+ 500+ Qty
ZA1-10-2-1.00-Z-10  3D CAD
Standard delivery
5 - 7 working days *
ZA1-20-2-1.00-Z-10  3D CAD
Standard delivery
5 - 7 working days *
ZA1-30-2-1.00-Z-10  3D CAD
Standard delivery
5 - 7 working days *

* Delivery times are from point of order and subject to material availability.

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  • Technical Specification

This 1mm pitch ultra low 1mm profile interposer feature a choice of dual compression contacts or single compression with solder balls. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and higher speed performance.

Insulator Material: FR4

Contact Material: BeCu

Plating: Au over 50µ" (1.27µm) Ni

Current Rating: 1 A per pin (10 pins powered)

Operating Temp Range: -55 °C to +105 °C

RoHS Compliant: Yes