1.27 mm SEARAYâ„¢ High-Speed High-Density Open-Pin-Field Array Terminal

SEAM - Samtec 1.27mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal (SEAM)

From: £2.729
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  • 1.27mm pitch grid array PCB footprint
  • 5, 8 and 10 row footprint compatible with SamArray®
  • Rugged Edge Rate® contacts 
  • lower insertion and withdrawal forces
  • Up to 500 I/Os, solder charge termination
  • 7 mm - 17.5 mm stack heights
  • Samtec 28+ Gbps Solution, dual sourced by Molex®
  • Contact sales@toby.co.uk for samples and more information
Part No. Stock Qty Price Breaks Qty
SEAM-50-03.5-S-08-2-A-K-FR  3D CAD
Standard delivery
10 - 12 working days *
175+: £21.30350+: £19.67525+: £16.01 View all prices
When ordering more than in stock, please contact us to confirm delivery time.
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* Delivery times are from point of order and subject to material availability.

* When ordering more than in stock, please contact us to confirm delivery time

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  • Technical Specification
  • Video
  • More Info

Insulator Material: Black LCP

Contact Material: Copper Alloy

Operating Temp Range: -55 °C to +125 °C

Current Rating (7 mm stack height): 1.8 A per pin (10 adjacent pins powered)

Plating: Au or Sn over 50 µ" (1.27µm) Ni

Contact Resistance: 5.5 mW

Working Voltage: 240 VAC

RoHS Compliant

Lead-Free Solderable

STANDARDS 

• PISMO 2 • VISTA 47 • VISTA 57.1 • VISTA 57.4

PROTOCOLS

• 100 GbE • Fiber Channel • Rapid I/O • PCI Express® • SATA • InfiniBand™

IPC-A-610F and IPC J-STD-001F Class 3 solder joint