1.27 mm SEARAYâ„¢ High-Speed High-Density Open-Pin-Field Array Socket

SEAF - Samtec 1.27mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket (SEAF)

From: £2.522
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  • 1.27mm pitch grid array PCB footprint
  • 4,5,6, 8 and 10 row footprint compatible with SamArray®
  • Rugged Edge Rate® contacts 
  • lower insertion and withdrawal forces
  • Up to 500 I/Os, solder charge termination
  • 7mm - 17.5mm stack heights
  • Samtec 28+ Gbps Solution, dual sourced by Molex®
  • Contact askjim@toby.co.uk for more information
Part No. Stock Qty Price Breaks Qty
SEAF-40-07.5-S-10-1-A-K-TR  3D CAD
Ten rows
Standard delivery
8 - 10 working days *
1+: £21.7510+: £21.1425+: £20.03 View all prices
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  • Technical Specification
  • Video
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Insulator Material: Black LCP

Contact Material: Copper Alloy

Operating Temp Range: -55 °C to +125 °C

Current Rating (7 mm stack height): 1.8 A per pin (10 adjacent pins powered)

Plating: Au or Sn over 50 µ" (1.27µm) Ni

Contact Resistance: 5.5 mW

Working Voltage: 240 VAC

RoHS Compliant

Lead-Free Solderable

These high speed, high density open pin field arrays allow maximum grounding and routing flexibility.

STANDARDS: • PISMO 2 • VITA 47 • VITA 57

PROTOCOLS • 100 GbE • FIber Channel • Rapid I/O • PCIExpress® • SATA • InfiniBand™

IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products

IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products