HDAF - 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

HDAF - Samtec 2mm x 1.2mm HD Mezz Rugged, High-Density Open-Pin-Field Array (HDAF)

From: £11.20
Copied to clipboard
  • Application specific capability to build any height from 20mm to 35mm
  • Open pin field design, integrated guide posts minimize contact damage during mating cycles
  • Solder charge termination for ease of processing
  • Performance: Up to 9GHz/18Gbps
  • 2mm x 1.2mm pitch, Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated
Part No. Stock Qty Price Breaks Qty
HDAF-11-08.0-S-13-2  3D CAD
Standard delivery
10 - 12 working days *
1+: £27.9510+: £27.1825+: £25.75 View all prices
When ordering more than in stock, please contact us to confirm delivery time.
There was a problem adding this item to the cart. Please contact us on the above number to order.

* Delivery times are from point of order and subject to material availability.

* When ordering more than in stock, please contact us to confirm delivery time

* Need help or more stock/delivery information or volume pricing - Please contact us

  • Technical Specification
  • Video
  • More Info

Insulator Material: Black LCP

Contact Material: Copper Alloy

Plating: Au or Sn over 50µ" (1,27µm) Ni

Current Rating: 3.4 A per pin (6 adjacent pins powered)

Operating Temp Range: -55°C to +125°C

Contact Resistance: 19 mΩ

Working Voltage: 200 VAC

Mated Cycles: 100

RoHS Compliant

Lead-Free Solderable

HDAF Series is a 2.00 mm x 1.20 mm pitch, rugged High-Density Open-Pin-Field Array Socket