HDAF - 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

HDAF - Samtec 2mm x 1.2mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket (HDAF)

From: £12.16
  • Application specific capability to build any height from 20mm to 35mm
  • Open pin field design, integrated guide posts minimize contact damage during mating cycles
  • Solder charge termination for ease of processing
  • Performance: Up to 9GHz/18Gbps
  • 2mm x 1.2mm pitch, Up to 299 I/Os
  • Dual sourced by Molex®
Part No. Stock Qty 1+ 100+ 500+ 1000+ Qty
HDAF-11-08.0-S-13-2  3D CAD
1 in stock £15.23£15.21£13.32£12.16
HDAF-11-08.0-S-13-2-P  3D CAD
Standard delivery
11 - 13 working days *
£15.35£15.33£13.44£12.29
HDAF-15-08.0-S-13-2  3D CAD
1 in stock £19.04£18.99£16.65£15.20
HDAF-23-08.0-S-13-2  3D CAD
1 in stock £26.55£26.53£23.21£21.19
HDAF-23-08.0-S-13-2-P  3D CAD
Standard delivery
11 - 13 working days *
£26.68£26.68£23.33£21.31

* Delivery times are from point of order and subject to material availability.

* When ordering more than in stock standard delivery time applies.

* Need help or more stock/delivery information or volume pricing - Please contact us

  • Technical Specification

Insulator Material: Black LCP

Contact Material: Copper Alloy

Plating: Au or Sn over 50µ" (1,27µm) Ni

Current Rating: 3.4 A per pin (6 adjacent pins powered)

Operating Temp Range: -55°C to +125°C

Contact Resistance: 19 mΩ

Working Voltage: 200 VAC

Mated Cycles: 100

RoHS Compliant

Lead-Free Solderable