ADF6-60-03.5-L-4-2-A-TR WEB PIC 1
ADF6-60-03.5-L-4-2-A-TR WEB PIC 1
ADF6-60-03.5-L-4-2-A-TR WEB PIC 2
ADF6-60-03.5-L-4-2-A-TR WEB PIC 3

ADF6 - Samtec 0.635mm AcceleRate® HD High-Density 4 Row Socket(hwp23) (ADF6)

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  • Incredibly dense with up to 240 total I/Os
  • Low profile 5mm stack height and slim 5mm width
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
Part No. Stock Qty Price Breaks Qty
ADF6-60-03.5-L-4-2-A-TR  3D CAD
92 in stock 1+: £20.0110+: £19.4625+: £18.43 View all prices
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  • Technical Specification
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Packaging Type: Tape & Reel = -FR Option = ‘Full Reel’ package - Most Cost Effective Pack option

Tape & Reel products ordered in less than full reel quantities (-TR Type) will be provided without leader and trailer.

Only products ordered in Full Reel (-FR) increments will have a leader and trailer.

Insulator Material:  Black LCP

Contact Material:  Copper Alloy

Plating:  Au or Sn over 50 μ" (1.27 μm) Ni

Operating Temp Range:  -55 °C to +125 °C

Current Rating:  1.34 A per pin (4 pins powered)

RoHS Compliant:  Yes

 

AcceleRate® HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications.

The surface of the contact is milled creating a smooth mating surface, which reduces wear on the contact increasing durability and cycle life. Also, lower insertion and withdrawal forces allow zippered unmating. ADF6 series is incredibly dense with up to 240 total I/Os with up to 400 in development. Low profile 5mm stack height, slim 5mm width and 4 row design feature in this connector. Available 0 - 60 positions per row. 70 - 100 total positions per row in development, 7 - 16 mm stack heights, right-angle and cable are also in development

ADF6 series utilises Samtec's Edge Rate® contact system optimized for signal integrity performance. Open-pin-field design for grounding and routing flexibility, supports 56 Gbps PAM4 (28 Gbps NRZ) applications.

PCIe® Gen 5 compatible, with solder ball technology for simplified processing and self aligning. 7 - 16 mm stack heights, right-angle and cable in development